10 Pcs Rajiekart 1g GD900 Thermal Grease Paste Heat Sink Compound for CPU and Chip-sets.

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10 Pcs Rajiekart 1g GD900 Thermal Grease Paste Heat Sink Compound for CPU and Chip-sets. Expand

  • • Thermal Conductivity: > 4.8 W/M-K, Weight: Approx. 1 g.:; Color : Grey.
  • • GD900 thermal paste selects much tinier particle diameter metal oxide as the main raw materials, for filling the gap between the heat source and heat sink device.
  • • Its outstanding performance on the CPU, GPU will meet your high standard demand for cooling system.

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₹ 299.00

 

  • • Thermal Conductivity: > 4.8 W/M-K, Weight: Approx. 1 g.:; Color : Grey.
  • • GD900 thermal paste selects much tinier particle diameter metal oxide as the main raw materials, for filling the gap between the heat source and heat sink device.
  • • Its outstanding performance on the CPU, GPU will meet your high standard demand for cooling system. It is generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers.
  • • It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, thereby increasing the overall efficiency of the component / device.
  • • High Thermal Conductivity Low and Thermal Resistance. Electrically Non-Conductive Non-Curing Non-Capacitive Non-Corrosive Bleed resistant Temp resistant

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